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Features
* * * * * * * * *
700 MHz to 2500 MHz Operating Frequency Very Low Noise Floor Performance Very Good Carrier and Sideband Suppression Supports Wideband Baseband Input Low LO Drive Requirements Power-down Mode No External IF Filter Supply Voltage 5 V Small SSOP16 Package
Applications
* * * *
Infrastructure Digital Communication Systems DCS/PCS/UMTS Transceivers ISM Band Transceivers GMSK, QPSK, QAM, 8PSK, SSB Modulators
700 to 2500 MHz Direct Quadrature Modulator T0790 Preliminary
Electrostatic sensitive device. Observe precautions for handling.
Description
The T0790 is a direct quadrature modulator using Atmel's Silicon-Germanium (SiGe) process. It features a frequency range from 700 up to 2500 MHz with excellent carrier and sideband suppression and a low noise floor. The typical output power is -11 dBm with an IM3 suppression greater than 60 dB. The T0790 targets a wide range of communication applications including 3G wireless. Figure 1. Block Diagram
16 1
BBQN BBQP
LOP LON
4 5
0 90
13 12
RFP RFN
BBIP BBIN
8 9
Rev. 4555A-SIGE-12/02
1
Pin Configuration
Figure 2. Pinning SSOP16
BBQP VCC GND LOP LON GND /SD BBIP 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 BBON VCC GND RFP RFN GND VCC BBIN
Pin Description
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol BBQP VCC GND LOP LON GND /SD BBIP BBIN VCC GND RFN RFP GND VCC BBQN Function Q-channel baseband, positive input +5 V power supply Ground Local oscillator, positive input Local oscillator, negative input Ground Shut-down control I-channel baseband, positive input I-channel baseband, negative input +5 V power supply Ground RF, negative output RF, positive output Ground +5 V power supply Q-channel baseband, negative input
2
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Absolute Maximum Ratings
All voltages are referred to GND.
Parameters Supply voltage LO, RF input Input voltage Operating temperature Storage temperature Symbols VCC LOP, LON, RFP, RFN BBIP, BBIN, BBQP, BBQN TOP Tstg Value 5.5 10 3 -40 to +85 -65 to +150 Unit V dBm V C C
Thermal Resistance
Parameters Junction ambient Junction case Symbols RthJA RthJC Value TBD 46 Unit K/W C/W
Electrical Characteristics
Test conditions: VCC = +5 V, Tamb = +25C, baseband inputs: 1.9 V DC bias, 200 kHz frequency, 300 mVp-p, 600 mVp-p differential drive, I/Q signals in quadrature, LO input: -5 dBm at 1960 MHz
700 to 1000 MHz Operation No. 1 1.1 1.2 1.3 Parameters RF Output Frequency range Output power RF port return loss 1dB-output compression point LO leakage Sideband suppression IM3 suppression Two-tone baseband input at 600 mVp-p differential per tone Matched to 50 W (refer to schematics) Compression point 12, 13 12, 13 12, 13 12, 13 12, 13 12, 13 12, 13 f PRF out RL 700 -13.0 -10.5 20 1000 -9.0 1700 -15.0 -11.5 16 2500 -10 MHz dBm dB B A D Test Conditions Pin Symbols Min. Typ. Max. 1700 to 2500 MHz Operation Min. Typ. Max. Unit Type*
1.4
P1dB
3
4
2
3
dBm
A
1.5 1.6 1.7
ALO ASB AIM3 34 58
-40 40 62
-34 34 58
-40 40 65
-32
dBm dB dB
D D D
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter.
3
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Electrical Characteristics (Continued)
Test conditions: VCC = +5 V, Tamb = +25C, baseband inputs: 1.9 V DC bias, 200 kHz frequency, 300 mVp-p, 600 mVp-p differential drive, I/Q signals in quadrature, LO input: -5 dBm at 1960 MHz
700 to 1000 MHz Operation No. 1.8 Parameters Broadband noise floor Test Conditions Baseband inputs tied to 1.9 VDC, -20 MHz offset from carrier Pin 12, 13 Symbols Pnoise Min. Typ. -154 Max. -148 1700 to 2500 MHz Operation Min. Typ. -155 Max. -148 Unit dBm/ Hz Type* C
1.9 1.10 2 2.1
Quadrature phase error I/Q amplitude balance Modulation Input Baseband frequency input -3dB bandwidth, baseband inputs terminated in 50 W Per pin Per pin
12, 13 12, 13 1, 8, 9, 16 fBB
-2 -0.2
0.5 0.5
+2 +0.2
-2 -0.2
0.5 0.5
+2 +0.2
C dB
B B
DC
500
DC
500
MHz
D
2.2 2.3 3 3.1 3.2 3.3
Baseband input resistance Baseband input capacitance LO Input LO frequency LO drive level LO port return loss Miscellaneous Shut-down attenuation Shut-down pin resistance Shut-down pin capacitance Shut-down input thresholds
1, 8, 9, 16 1, 8, 9, 16 4, 5 4, 5
RBB CBB
4.4 0.5
4.4 0.5
kW pF
D D
fLO PLO RLLO
700 -8 -5 16
2500 -2
700 -8 -5 16
2500 -2
MHz dBm dB
B D C
Matched to 50 W (refer to schematic)
4, 5
4 4.1 4.2 4.3 4.4
7 at 1 MHz at 1 MHz Shut-down disabled (normal operation) Shut-down enable 7 7 7
ASD RSD CSD 3.75
60 11.9 5.2 VCC 3.75
60 11.9 5.2 VCC
dB kW pF V
D D D D
7
0
1.5
0
1.5
V
D
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter.
4
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T0790
Electrical Characteristics (Continued)
Test conditions: VCC = +5 V, Tamb = +25C, baseband inputs: 1.9 V DC bias, 200 kHz frequency, 300 mVp-p, 600 mVp-p differential drive, I/Q signals in quadrature, LO input: -5 dBm at 1960 MHz
700 to 1000 MHz Operation No. 4.5 4.6 Parameters Shut-down settling time Supply voltage Test Conditions Pin 7 2, 10, 15 2, 10, 15 VCC 4.75 Symbols Min. Typ. 16 5 5.25 4.75 Max. 1700 to 2500 MHz Operation Min. Typ. 16 5 5.25 Max. Unit ns V A Type*
4.7
Supply current
73
82
73
82
mA
A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter.
5
4555A-SIGE-12/02
700 MHz to 1000 MHz: Typical Device Performance
Figure 3. SSB Power Versus LO Frequency
SSB Power vs. LO Frequency
-5 -7 SSB Power (dBm) -9 -11 -13 -15 700
750
800
850
900
950
1000
LO Frequency (MHz)
Figure 4. Output P1dB Versus LO Frequency
Output P1dB vs. LO Frequency
10 8 6 4 2 0 700
Output P1dB (dBm)
750
800
850
900
950
1000
LO Frequency (MHz)
Figure 5. Carrier Feedthrough Versus LO Frequency
Carrier Feedthrough vs. LO Frequency
-30 Carrier Feedthrough (dBm) -34 -38 -42 -46 -50 700
750
800 850 900 LO Frequency (MHz)
950
1000
6
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Figure 6. Sideband Suppression Versus LO Frequency
Sideband Suppression vs. LO Frequency
50 Sideband Suppression (dBm) 46 42 38 34 30 700
750
800
850
900
950
1000
LO Frequency (MHz)
Figure 7. Intermodulation Distortion Versus SSB Output Power
Intermodulation Distortion vs. SSB Output Power @880 MHz
0 Output Power (dBm) -20 -40 -60 -80 -100 -12 -10 -8 -6 -4 -2 0 2 4 6 BB Input Level (dBVp-p diff.) fundamental (each t one) 3rd intermod. (each tone)
Figure 8. RF and LO Return Losses
RF & LO Port Return Losses
0 RFPort LO Port Return Loss (dB) 10
20
30
40 700
750
800
850
900
950
1000
Frequency (MHz)
7
4555A-SIGE-12/02
1500 MHz to 2500 MHz: Typical Device Performance
Figure 9. SSB Power Versus LO Frequency
SSB Power vs. LO Frequency
-5 -7 SSB Power (dBm) -9 -11 -13 -15 1500 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 LO Frequency -40C +25 C +85 C
Figure 10. Output P1dB Versus LO Frequency
Output P1dB vs. LO Frequency
10 8 6 4 2 0 1500
Output P1dB (dBm)
1700
1900
2100
2300
2500
LO Frequency (MHz)
Figure 11. Carrier Feedthrough Versus LO Frequency
Carrier Feedthrough vs. LO Frequency
-30 Carrier Feedthrough (dBm) -34 -38 -42 -46 -50 1500 -40C +25C +85C 1700 1900 2100 2300 2500
LO Frequency (MHz)
8
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T0790
Figure 12. Sideband Suppression Versus LO Frequency
Sideband Suppression vs. LO Frequency
50 Sideband Suppression (dBm) 46 42 38 34 30 1500 -40C +25C +85C 1700 1900 2100 2300 2500
LO Frequency (MHz)
Figure 13. Intermodulation Distortion Versus SSB Output Power
Intermodulation Distortion vs. SSB Output Power @1960 MHz
0 BB Input Level (dBVp-p diff.) -20 -40 -60 -80 -100 -12 -10 -8 -6 -4 -2 0 2 4 6 Output Power (dBm) 3rd Intermod. (each tone) Fundamental (each tone) -40C +27C +85C
Figure 14. RF and LO Return Losses
RF & LO Port Return Losses
0 5 Return Loss (dB) 10 15 20 25 30 1500 RFPort LO Port
1700
1900
2100
2300
2500
Frequency (MHz)
9
4555A-SIGE-12/02
Figure 15. Application Schematic
+5V
L1
VCC
P8
P9
C3 C6
VCC R1 1 2 3 4 5 6 7 8 D1 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 R7 16 15 14 13 12 11 10 9
VCC C9
LOin P10 8 C1 1 T3 5 4
C4
C10 4 5 T4 1 8 RFout C16 C2 P11
C5 C17
T0790
R9 SH1 R8 P12
R10 VCC
C18
P13
Bill of Materials (700 MHz to 1000 MHz Evaluation Board)
Component Designator D1 P8, P9, P10, P11, P12, P13 T3, T4 L1 R1, R7, R9, R10 R8 C6,C18 C9,C17 C3 C4, C5, C10, C16 C1, C2 SH1 Notes: 1. May vary due to printed board layout and material. 1:1 1 H 200 W 1 kW 33 pF 1 nF 2.2 F 10 pF n.c. Value (1) Vendor Atmel Johnson Components Panansonic Wurth Elektronik Part Number T0790 142-0701-856 EHF-FD1618 74476401 Description I/Q modulator SMA connector, end launch with tab, for 0.062 inch board RF transformer, 700 MHz to 1300 MHz Inductor, 1210 footprint, 10% tolerance Resistor, 1206 footprint, 1% tolerance Resistor, 0603 footprint, 1% tolerance Capacitor, 0603 footprint, COG dielectric, 0.25 pF tolerance Capacitor, 0603 footprint, COG dielectric, 5% tolerance Capacitor, 1206 footprint, Y5V dielectric, 16 V rating Capacitor, 0603 footprint, COG dielectric, 0.25 pF tolerance Capacitor, 0603 footprint, COG dielectric, 0.25 pF tolerance Shunt for 2-pin header
10
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Bill of Materials (for 1700 MHz to 2500 MHz Evaluation Board)
Component Designator D1 P8, P9, P10, P11, P12, P13 T3, T4 L1 R1, R7, R9, R10 R8 C6,C18 C9,C17 C3 C4, C5, C10, C16 C1, C2 SH1 Note: 1. May vary due to printed board layout and material. 1:1 1 H 200 W 1 kW 6.8 pF 1 nF 2.2 F 2.7 pF 0.5 pF Value (1) Vendor Atmel Johnson Components Panansonic Wurth Elektronik Part Number T0790 142-0701-856 EHF-FD1619 74476401 Description I/Q modulator SMA connector, end launch with tab, for 0.062 inch board RF transformer, 1200 MHz to 2200 MHz Inductor, 1210 footprint, 10% tolerance Resistor, 1206 footprint, 1% tolerance Resistor, 0603 footprint, 1% tolerance Capacitor, 0603 footprint, COG dielectric, 0.25 pF tolerance Capacitor, 0603 footprint, COG dielectric, 5% tolerance Capacitor, 1206 footprint, Y5V dielectric, 16 V rating Capacitor, 0603 footprint, COG dielectric, 0.25 pF tolerance Capacitor, 0603 footprint, COG dielectric, 0.25 pF tolerance Shunt for 2-pin header
Figure 16. Demo Test Board (Fully Assembled PCB)
2" P8 P9
1 2 H1 2" L1 P10 T3 C3
R1 C6 C4 C5 C17 R8 R9 H2 1 2 P14
R7 C9 C10 C16 C18 R10 P11 T4 C2
C1
SH1
P12
P13
11
4555A-SIGE-12/02
Recommended Package Footprint
Note: In order to avoid soldering problems, plugging of the ground vias under the heat slug is recommended!
1.25
0.30 0.62 0.62
3.0
0.35
3.0
f0.25 via
0.7
0.9
6.9
all units are in mm - Indicates metalization - vias connect pad to underlying ground plane
12
T0790
4555A-SIGE-12/02
T0790
Ordering Information
Extended Type Number T0790-6C Package SSOP16 Remarks TBD
Package Information
13
4555A-SIGE-12/02
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4555A-SIGE-12/02 xM

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